Package Included

- 1 x Electronic Tin Solder Paste Flux

Description:

- Volume: 10cc
- Excellent capacity of solder-stickiness
- Excellent Anti-wet Capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.