Package Included
- 1 x Electronic Tin Solder Paste Flux
- 1 x Syringe Rod
Description:
- Volume: 10cc
- Excellent capacity of solder-stickiness
- Excellent Anti-wet Capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Standard: $5.99
Rural: $8.99
WE SHIP ORDRS AT 11 AM EVERY DAY, except weekends&public holidays. All paid orders received by 10.30 am will be shipped on the same day.