Package Included
- 1 x Electronic Tin Solder Paste Flux
Description:
- Volume: 10cc
- Excellent capacity of solder-stickiness
- Excellent Anti-wet Capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Shipping: $5.99 urban, $9.99 rural. Free shipping on orders of $100 or more.
Order by 10:30am (NZT), Monday to Friday, and we dispatch the same day. Orders placed after 10:30am, on weekends or on public holidays are dispatched the next business day.
Delivery usually takes 1–2 business days after dispatch (2–3 for rural addresses). See our Shipping Policy for full details.